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Tel: +49 / 361 421 17 02
E-Mail: info@khs-semi.com
SI2D GmbH
Gustav-Tauschek-Str.7
99099 Erfurt/Germany
Assembly Equipment
Assembly Equipment
| Manufacturer | Modell | Beschreibung | Mehr |
|---|---|---|---|
| delvotec | 6200 | Goldball Wirebonder | Details |
| Delvotec/Siemens | 4500/Siplace A2 | Die Bonder | Details |
| ESI | 6150 | Laser Trimmer | Details |
| EVG | 520 | Manual wafer load substrate bonder | Details |
| F&S BONDTEC Semiconductor GmbH | 5610 | Gold ball wire bonder / Pull & Shear tester | Details |
| Hesse Mechatronics | Indexersystem | Details | |
| Lintec Corporation | RAD-2010M/12 | A semi-automatic UV irradiation system for UV curable dicing tape attached to ring frame for 300mm wafer. | Details |
| Polaris Electronics | Lid Tacker | Lid Tacker | Details |
