Assembly Equipment

Assembly Equipment

Manufacturer Modell Description More
Datacon 2200 APM Die Bonder Details
delvotec 6200 Goldball Wirebonder Details
Delvotec/Siemens 4500/Sieplace A2 Die Bonder Details
ESI 6150 Laser Trimmer Details
EVG 520 Manual wafer load substrate bonder Details
Hesse Mechatronics Indexersystem Details
K & S 4129 Deep-Access-Bonding Details
Polaris Electronics Lid Tacker Lid Tacker Details

For further information you can contact us