Assembly Equipment

Assembly Equipment

Manufacturer Modell Description More
Datacon 2200 APM Die Bonder Details
delvotec 6200 Goldball Wirebonder Details
Delvotec/Siemens 4500/Sieplace A2 Die Bonder Details
ESI 6150 Laser Trimmer Details
EVG 520 Manual wafer load substrate bonder Details
F&S BONDTEC Semiconductor GmbH 5610 Gold ball wire bonder / Pull & Shear tester Details
Hesse Mechatronics Indexersystem Details
K & S 4129 Deep-Access-Bonding Details
Lintec Corporation RAD-2010M/12 A semi-automatic UV irradiation system for UV curable dicing tape attached to ring frame for 300mm wafer. Details
Polaris Electronics Lid Tacker Lid Tacker Details

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