Assembly Equipment
Assembly Equipment
Manufacturer | Modell | Description | More |
---|---|---|---|
Datacon | 2200 APM | Die Bonder | Details |
delvotec | 6200 | Goldball Wirebonder | Details |
Delvotec/Siemens | 4500/Sieplace A2 | Die Bonder | Details |
ESI | 6150 | Laser Trimmer | Details |
EVG | 520 | Manual wafer load substrate bonder | Details |
F&S BONDTEC Semiconductor GmbH | 5610 | Gold ball wire bonder / Pull & Shear tester | Details |
Hesse Mechatronics | Indexersystem | Details | |
K & S | 4129 | Deep-Access-Bonding | Details |
Lintec Corporation | RAD-2010M/12 | A semi-automatic UV irradiation system for UV curable dicing tape attached to ring frame for 300mm wafer. | Details |
Polaris Electronics | Lid Tacker | Lid Tacker | Details |